Arbitrary Modeling of TSVs for 3D Integrated Circuits formatIsbn:Softcover - 9783319374970 Neben weiterem Fortbildungsbedarf in Palliative

Neben weiterem Fortbildungsbedarf in Palliative Care und der Diskussion ethischer Konfliktsituationen in den Pflegeteams bedarf es ferner einer stärkeren Integration der Thematik in die Altenpflegeausbildung

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Arbitrary Modeling of TSVs for 3D Integrated Circuits formatIsbn:Softcover - 9783319374970 Neben weiterem Fortbildungsbedarf in PalliativeThis book presents a wide band and technology independent, SPICE compatible RLC model for through silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for